BOE-ziSIM: Photolithography Simulation Software for Efficient Device Production

The photolithography process is a crucial step in the production of electronic devices, such as display panels and semiconductor chips. It involves transferring a pattern onto a substrate using light and chemicals. However, achieving the desired results often requires a large number of experiments, which can be both time-consuming and expensive. \u003cbr\u003e\u003cbr\u003eTo address this issue, a software called BOE-ziSIM has been developed. It is a photolithography simulation module based on the physical model of the process. The main objective of this software is to design and optimize the mask patterns and process parameters to achieve the desired results. \u003cbr\u003e\u003cbr\u003eThe software is available in two versions: a basic version and an improved version. The basic version only requires configuring two functions: line roughness and photoresist. This allows for a simple simulation of the process. However, for more detailed simulations, researchers can set parameters such as process layers, exposure parameters, and time and temperature parameters for post-baking and development. \u003cbr\u003e\u003cbr\u003eThe process layer settings allow users to specify the material type, material name, and thickness. The exposure parameter settings enable the configuration of parameters such as exposure wavelength, light source type, exposure focal length, and aperture value. These parameters can be set directly in the software interface or imported from external data sources. \u003cbr\u003e\u003cbr\u003eOnce the relevant parameters are configured, the software can calculate the exposure dose of the photoresist layer at different positions. This information can be used to predict the characteristics of the photoresist layer after exposure. Additionally, the software can simulate the structural evolution of the photoresist layer based on the chemical reaction kinetics parameters. This allows for the prediction of the morphology and thickness distribution of the photoresist layer. \u003cbr\u003e\u003cbr\u003eOne of the key advantages of photolithography simulation is its ability to provide forward predictions of process results. This not only helps in achieving the desired results but also enables the identification and resolution of process defects, thus reducing process costs. \u003cbr\u003e\u003cbr\u003eThe BOE-ziSIM photolithography simulation software is currently mainly used in the production of new display thin film transistors. By using this software, manufacturers can shorten the development time of new material process devices, improve yield rapidly, and save on technical development costs. The main users of this software are BOE display panel manufacturers and semiconductor industry research institutions. \u003cbr\u003e\u003cbr\u003eIn conclusion, the BOE-ziSIM photolithography simulation software offers a cost-effective and time-saving solution for optimizing the photolithography process. Its ability to predict process results and provide solutions for process defects makes it a valuable tool for manufacturers and research institutions in the display and semiconductor industries.