BOE-ziSIM 光刻仿真软件：优化工艺，提升良率

Abstract: The photolithography process requires a large number of experiments to achieve the desired results. However, conducting numerous experiments increases both economic and time costs. The photolithography simulation module of BOE-ziSIM is a software based on the physical model of the photolithography process. It designs and optimizes the mask patterns and photolithography process parameters with the goal of achieving the desired results.
\nThe software is divided into a basic version and an improved version. The basic photolithography simulation in the software only requires configuring two functions: line roughness and photoresist. More detailed simulations require setting parameters such as process layers, exposure parameters, and time and temperature parameters for post-baking and development. In the process layer settings, material type, material name, and thickness can be specified. In the exposure parameter settings, parameters such as exposure wavelength, light source type, exposure focal length, and aperture value can be set. These parameters can be configured in the interface or imported from external data for the convenience of researchers.
\nAfter configuring the relevant parameters, the software can calculate the exposure dose of the photoresist layer at different positions, thus predicting the characteristics of the photoresist layer after exposure. It can also simulate the structural evolution of the photoresist layer based on the chemical reaction kinetics parameters of the photoresist layer, and predict the morphology and thickness distribution of the photoresist layer.
\nPhotolithography simulation not only allows for forward prediction of process results, but also provides solutions for process defects, reducing process costs. The photolithography simulation of BOE-ziSIM is currently mainly used in the production of new display thin film transistors. Developing this software can shorten the development time of new material process devices, rapidly improve yield, and save technical development costs. Its main users are BOE display panel manufacturers and semiconductor industry research institutions.