BOE-ziSIM 光刻仿真软件：优化工艺，提升良率，节约成本

To achieve the desired results in photolithography, a large number of experiments are required. However, conducting numerous experiments increases the economic and time costs. BOE-ziSIM's photolithography simulation module is a software based on the physical model of photolithography process. It aims to design and optimize mask patterns and photolithography process parameters to obtain the expected results.\n\nThe software is divided into a simple version and an improved version. The simple photolithography simulation in the software only requires configuring the roughness of the photolithography lines and the related functions of the photoresist. The more refined simulation requires setting parameters such as the material types of the multi-layer anti-etching agent layer and material layer, exposure parameters, and time and temperature parameters for post-baking and development. After setting the relevant parameters, the software can calculate the exposure dose of the photoresist layer at different positions to predict the characteristics of the photoresist layer after exposure. It can also simulate the structural evolution process of the photoresist layer based on the chemical reaction kinetics parameters of the photoresist layer, and predict the morphology and thickness distribution of the photoresist layer.\n\nPhotolithography simulation not only forward predicts the process results but also provides solutions for defects in the process, reducing process costs. BOE-ziSIM's photolithography simulation is currently mainly used in the development of new display thin film transistors. Developing this software can shorten the development time of new material process devices, quickly improve yield, and save technical development costs. Its main users are BOE display panel manufacturers and semiconductor industry research institutions.