Fabrication of TP-PENG Device Using Sandwich Structure with Piezoelectric Nanofiber Membrane

The TP-PENG device was fabricated by assembling various components, including a TP nanofiber membrane, a PI substrate, copper foil, and PI tape. The fabrication process involved creating a sandwich structure. Initially, a conductive copper foil was tightly adhered to a PI substrate using solid flexible glue. Subsequently, the prepared piezoelectric nanofiber film was transferred onto the surface of the conductive copper foil and the PI substrate. To complete the sandwich structure, another piece of conductive copper foil with a PI substrate was placed on top of the piezoelectric nanofiber film. Finally, the TP-PENG device was encapsulated and protected using PI tape to prevent any damage during testing and subsequent use.