SGM5100/SGM5101 Heat Dissipation and Grounding Best Practices
The majority of the heat produced by the SGM5100/SGM5101 is moved from the internal components to the printed circuit board (PCB) through the exposed pad on the underside. To ensure optimal electrical and thermal efficiency, it is important to solder the exposed pad to a sizable grounded pad on the PCB. It is crucial to connect all ground pins to a sufficiently large ground plane.
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