SGM5100/SGM5101 Heat Dissipation and Grounding Best Practices

The majority of the heat produced by the SGM5100/SGM5101 is transferred from the internal component to the printed circuit board through the exposed pad and package leads on its bottom side. To ensure optimal electrical and thermal efficiency, it's important to solder the exposed pad to a large grounded pad on the PCB. It's crucial to connect all ground pins to a ground plane that is adequately sized.