SGM5100/SGM5101 Heat Dissipation and Grounding Requirements

The majority of the heat produced by the SGM5100/SGM5101 is moved from the die to the printed circuit board through the exposed pad on the bottom side and the package leads. To ensure optimal electrical and thermal efficiency, it is important to solder the exposed pad to a sizable grounded pad on the PC board. It is crucial that all ground pins are properly connected to a ground plane that is large enough.