Foveros: Intel's 3D Chip Stacking Technology for Enhanced Performance

Foveros is a technology developed by Intel that allows for the stacking of multiple dies (or chips) on top of each other to create a three-dimensional chip. This allows for more efficient use of space and improved performance, as the different components can be optimized for their specific tasks. Foveros technology has been used in Intel's Lakefield processors, which combine high-performance cores with low-power cores in a compact form factor. It is expected to be used in future Intel products to continue to improve performance and efficiency.