导热绝缘聚合物复合材料广泛应用于发光二极管、集成电子设备、储能和 转换系统、军事武器、航空航天等领域具有良好的热管理功能1-3。随着电气 系统和电子器件性能的快速发展传统的聚合物基导热复合材料已不能满足对 热管理的高要求4 5。高分子材料具有优异的电气绝缘性能、柔性和设计自由度 6。然而高分子材料低的本征导热系数严重限制了它们在热管理中的适用性。 结合聚合物的优点和填料的高导热系数的复合材料被认为

Thermally conductive insulating polymer composites are widely used in fields such as light emitting diodes, integrated electronic devices, energy storage and conversion systems, military weapons, and aerospace, with excellent thermal management functions. However, with the rapid development of electrical systems and electronic devices, traditional polymer-based thermally conductive composites are unable to meet the high requirements for thermal management. Polymer materials have excellent electrical insulation properties, flexibility, and design freedom. However, their low intrinsic thermal conductivity severely limits their applicability in thermal management. Composite materials combining the advantages of polymers and high thermal conductivity fillers are considered ideal thermal management materials. Therefore, it is necessary to retain the enhanced thermal conductivity brought by fillers while maintaining the flexibility, processability, lightweight, and electrical insulation properties of the composite materials