翻译 光刻工艺要得到预期的结果需要进行大量的实验以不断优化光刻工艺参数。这不仅增加了经济成本和时间成本还限制了新材料工艺器件的开发速度。为解决这一问题BOE-ziSIM开发了一款基于光刻工艺物理模型的光刻仿真模块。该软件以预期结果为目标对掩模版图形和光刻工艺参数进行设计与优化。BOE-ziSIM的光刻仿真软件分为简单版本和改进版本。简单版本只需配置光刻线条粗糙度和光刻胶两个功能。更精细化的仿真需要

In order to achieve the desired results in lithography process, a large number of experiments are required to continuously optimize lithography process parameters. This not only increases the economic and time costs, but also limits the development speed of new material process devices. To solve this problem, BOE-ziSIM has developed a lithography simulation module based on lithography process physical models. The software designs and optimizes mask patterns and lithography process parameters with the goal of achieving the desired results.

The lithography simulation software of BOE-ziSIM is divided into a basic version and an improved version. The basic version only requires the configuration of lithography line roughness and lithography resist functions. More detailed simulations require setting parameters such as process layers, exposure parameters, post-bake and development time and temperature parameters. Material types, material names, and thickness can be set in the process layers, while exposure wavelength, light source type, exposure focal length, and aperture value can be set in the exposure parameters. These parameters can be set in the interface or imported from external sources, making it convenient for researchers to use.

After setting the relevant parameters, the software can predict the characteristics of the lithography resist layer after exposure by calculating the exposure dose at different positions of the resist layer. It can also simulate the structural evolution process of the resist layer based on the chemical reaction kinetics parameters of the resist layer, and predict the morphology and thickness distribution of the resist layer.

Lithography simulation can not only forward predict process results, but also provide solutions for defects in the process, thereby reducing process costs. Through lithography simulation, researchers can optimize the process before conducting experiments, reducing the number of experiments and material waste. At the same time, the simulation software can provide solutions for problems and defects that occur in the process, helping researchers quickly adjust process parameters and improve process yield. Currently, BOE-ziSIM's lithography simulation is mainly used in the manufacturing of new display thin film transistors, with major users being BOE display panel manufacturers and semiconductor industry research institutions