翻译摘要：光刻工艺为得到预期结果需要进行大量实验但大量的实验会增加经济成本和时间成本。BOE-ziSIM的光刻仿真模块是基于光刻工艺物理模型以预期结果为目标对掩模版图形和光刻工艺参数进行设计与优化的软件。 该软件分为简单版本和改进版本。该软件中简单的光刻仿真只需要配置两个功能：光刻线条粗糙度和光刻胶；更精细化的仿真需要设置工艺叠层等参数、曝光参数、后烘和显影的时间和温度参数。工艺叠层中可以设置材料

Abstract: The photolithography process requires a large number of experiments to achieve the desired results. However, conducting numerous experiments increases both economic and time costs. The photolithography simulation module of BOE-ziSIM is a software based on the physical model of the photolithography process. It designs and optimizes the mask patterns and photolithography process parameters with the goal of achieving the desired results.

The software is divided into a basic version and an improved version. The basic photolithography simulation in the software only requires configuring two functions: line roughness and photoresist. More detailed simulations require setting parameters such as process layers, exposure parameters, and time and temperature parameters for post-baking and development. In the process layer settings, material type, material name, and thickness can be specified. In the exposure parameter settings, parameters such as exposure wavelength, light source type, exposure focal length, and aperture value can be set. These parameters can be configured in the interface or imported from external data for the convenience of researchers.

After configuring the relevant parameters, the software can calculate the exposure dose of the photoresist layer at different positions, thus predicting the characteristics of the photoresist layer after exposure. It can also simulate the structural evolution of the photoresist layer based on the chemical reaction kinetics parameters of the photoresist layer, and predict the morphology and thickness distribution of the photoresist layer.

Photolithography simulation not only allows for forward prediction of process results, but also provides solutions for process defects, reducing process costs. The photolithography simulation of BOE-ziSIM is currently mainly used in the production of new display thin film transistors. Developing this software can shorten the development time of new material process devices, rapidly improve yield, and save technical development costs. Its main users are BOE display panel manufacturers and semiconductor industry research institutions